Peak Electronic Design Ltd

No reasons were given for STMicro's and TSMC's admission to the listing or Lattice's de-listing.

Company Contacts

IDC's Rau contends that the elusive PC upgrade cycle–expected to spur corporate IT spending and lift the semiconductor market out of its doldrums–will kick in during the second half of this year. However, with manufacturing capacity in oversupply throughout the industry, analysts believe ASPs will stay under pressure for a long time to come.

capacitors in circuits

No reasons were given for STMicro's and TSMC's admission to the listing or Lattice's de-listing.

Company Contacts

IDC's Rau contends that the elusive PC upgrade cycle–expected to spur corporate IT spending and lift the semiconductor market out of its doldrums–will kick in during the second half of this year. However, with manufacturing capacity in oversupply throughout the industry, analysts believe ASPs will stay under pressure for a long time to come.

Another significant difference is that the RLDRAM employs a non-multiplexed address bus that is similar to most SRAM architectures. The address bus is multiplexed in FCRAM, which not only adds the complication of dealing with multiplexed buses not found in SRAM replacement designs, but also degrades the maximum speed and performance at which the FCRAM can operate. In fact, the second-generation FCRAM reaches clock rates of only 200 MHz, while an RLDRAMmanufactured in the same process technology can be clocked at a maximum of 300 MHz. As a result, the RLDRAM can move data at a rate of 600 Mbit/s per pin, while an FCRAM's theoretical maximum is 400 Mbit/s per pin.

The NanoFree package makes use of SnAgCu (Tin Silver Copper) ball alloy and is classified per J-STD-020B (max reflow temp of 250C) Pb-free parameters, however, this package reaches a max reflow of 260C. With a ball pitch of 0.5mm, these self-planarizing balls allow minimal positional tolerance when placing the device on the board, thus enhancing manufacturability.

– Tillverkningsindustrin och sjukvården är dominerande områden för Bluetooth, säger Joyce Putscher, analytiker på In-Stat/MDR i USA. Bluetooth som en ren kabelersättare kommer att växa snabbt.

1809941

Company Contacts

IDC's Rau contends that the elusive PC upgrade cycle–expected to spur corporate IT spending and lift the semiconductor market out of its doldrums–will kick in during the second half of this year. However, with manufacturing capacity in oversupply throughout the industry, analysts believe ASPs will stay under pressure for a long time to come.

Another significant difference is that the RLDRAM employs a non-multiplexed address bus that is similar to most SRAM architectures. The address bus is multiplexed in FCRAM, which not only adds the complication of dealing with multiplexed buses not found in SRAM replacement designs, but also degrades the maximum speed and performance at which the FCRAM can operate. In fact, the second-generation FCRAM reaches clock rates of only 200 MHz, while an RLDRAMmanufactured in the same process technology can be clocked at a maximum of 300 MHz. As a result, the RLDRAM can move data at a rate of 600 Mbit/s per pin, while an FCRAM's theoretical maximum is 400 Mbit/s per pin.

The NanoFree package makes use of SnAgCu (Tin Silver Copper) ball alloy and is classified per J-STD-020B (max reflow temp of 250C) Pb-free parameters, however, this package reaches a max reflow of 260C. With a ball pitch of 0.5mm, these self-planarizing balls allow minimal positional tolerance when placing the device on the board, thus enhancing manufacturability.

IDC's Rau contends that the elusive PC upgrade cycle–expected to spur corporate IT spending and lift the semiconductor market out of its doldrums–will kick in during the second half of this year. However, with manufacturing capacity in oversupply throughout the industry, analysts believe ASPs will stay under pressure for a long time to come.

Another significant difference is that the RLDRAM employs a non-multiplexed address bus that is similar to most SRAM architectures. The address bus is multiplexed in FCRAM, which not only adds the complication of dealing with multiplexed buses not found in SRAM replacement designs, but also degrades the maximum speed and performance at which the FCRAM can operate. In fact, the second-generation FCRAM reaches clock rates of only 200 MHz, while an RLDRAMmanufactured in the same process technology can be clocked at a maximum of 300 MHz. As a result, the RLDRAM can move data at a rate of 600 Mbit/s per pin, while an FCRAM's theoretical maximum is 400 Mbit/s per pin.

The NanoFree package makes use of SnAgCu (Tin Silver Copper) ball alloy and is classified per J-STD-020B (max reflow temp of 250C) Pb-free parameters, however, this package reaches a max reflow of 260C. With a ball pitch of 0.5mm, these self-planarizing balls allow minimal positional tolerance when placing the device on the board, thus enhancing manufacturability.

tant capacitor

Another significant difference is that the RLDRAM employs a non-multiplexed address bus that is similar to most SRAM architectures. The address bus is multiplexed in FCRAM, which not only adds the complication of dealing with multiplexed buses not found in SRAM replacement designs, but also degrades the maximum speed and performance at which the FCRAM can operate. In fact, the second-generation FCRAM reaches clock rates of only 200 MHz, while an RLDRAMmanufactured in the same process technology can be clocked at a maximum of 300 MHz. As a result, the RLDRAM can move data at a rate of 600 Mbit/s per pin, while an FCRAM's theoretical maximum is 400 Mbit/s per pin.

The NanoFree package makes use of SnAgCu (Tin Silver Copper) ball alloy and is classified per J-STD-020B (max reflow temp of 250C) Pb-free parameters, however, this package reaches a max reflow of 260C. With a ball pitch of 0.5mm, these self-planarizing balls allow minimal positional tolerance when placing the device on the board, thus enhancing manufacturability.

The NanoFree package makes use of SnAgCu (Tin Silver Copper) ball alloy and is classified per J-STD-020B (max reflow temp of 250C) Pb-free parameters, however, this package reaches a max reflow of 260C. With a ball pitch of 0.5mm, these self-planarizing balls allow minimal positional tolerance when placing the device on the board, thus enhancing manufacturability.

– Tillverkningsindustrin och sjukvården är dominerande områden för Bluetooth, säger Joyce Putscher, analytiker på In-Stat/MDR i USA. Bluetooth som en ren kabelersättare kommer att växa snabbt.

BOISE, Idaho — The losses mount at Micron Technology Inc., as the company reported a deficit of $214.9 million, or minus $0.36 a share, in the third fiscal quarter of 2003. This compared to loss of $619 million, or minus $1.02, in the previous quarter, and $24.2 million, or minus $0.04, in the like period a year ago.

When the original manufacturer discontinues production, GD California steps in as the aftermarket production and repairs supplier, charging a fee of 25% above the original manufacturer's price.