The thick film resistor is non-inductive (< 0.1 µH) and features a resistance range from 1 O to 1.3 kO. The compact footprint, low 25 mm profile, and low weight of 79 grams, save valuable space. With high power capabilities and high dielectric strength to 12 kVRMS , the LPS1100 targets power supply, inverter, converter, HEV-EV battery management, and snubber, chopper, pre-charge, discharge, filtering, and crowbar resistor applications. End products will include windmill turbines, X-ray and oncology tables, trains, and large UPS drives.

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The Si3462 controller's architecture eliminates the need for a separate MCU and related software, simplifying overall system integration, mitigating software development costs and risks, and speeding time to market. The Si3462 device's detection, classification, power-up, fault monitoring, protection and disconnect processes all run according to hardware pin configurations without the assistance of a host processor or MCU. The Si3462 continuously monitors the power delivered to PDs, ensuring that each PD is operating safely and within all IEEE-required PoE/PoE+ specifications.   

For further information, contact any Microchip sales representative or authorized worldwide distributor, or visit this page .

www.dspsemi.com www.optimumsemi-tech.com

For its part, Fusion will back the SCSI Express approach because it is based on the work of a recognized standards group, the ANSI T10 committee. Access to the NVMe spec requires signing a legal document managed by Intel Corp., the group’s leader, said Gary Orenstein, vice president of products at Fusion IO.

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For further information, contact any Microchip sales representative or authorized worldwide distributor, or visit this page .

www.dspsemi.com www.optimumsemi-tech.com

For its part, Fusion will back the SCSI Express approach because it is based on the work of a recognized standards group, the ANSI T10 committee. Access to the NVMe spec requires signing a legal document managed by Intel Corp., the group’s leader, said Gary Orenstein, vice president of products at Fusion IO.

Renesas achieved the use of 2 mm × 2 mm ultra compact packages by placing large-area high-performance chips in miniature packages and using an exposed heat sinkminiature package, thus efficiently dissipating the package heat to the mounting board. The µPA2600 and similar products can reduce the mounting area by approximately 30 percent compared to existing 3 mm × 2 mm packages, and the µPA2672 and similar products can reduce the mounting area by approximately 40 percent compared to existing 3 mm × 3 mm packages. This can reduce the size and weight of end-use products.

I am pleased to announce that Epic will open an office in Brussels. We will implement closer collaboration with the EU in order to better represent the interests of our members and photonics, a key enabling technology and future EU Public-Private Partnership.” 

According to a report by the Reuters news service, the Nikkei reported that Toshiba could seek financial assistance from the government-backed Enterprise Turnaround Initiative Corp of Japan.

SLG7NT402VTR_Datasheet PDF

www.dspsemi.com www.optimumsemi-tech.com

For its part, Fusion will back the SCSI Express approach because it is based on the work of a recognized standards group, the ANSI T10 committee. Access to the NVMe spec requires signing a legal document managed by Intel Corp., the group’s leader, said Gary Orenstein, vice president of products at Fusion IO.

Renesas achieved the use of 2 mm × 2 mm ultra compact packages by placing large-area high-performance chips in miniature packages and using an exposed heat sinkminiature package, thus efficiently dissipating the package heat to the mounting board. The µPA2600 and similar products can reduce the mounting area by approximately 30 percent compared to existing 3 mm × 2 mm packages, and the µPA2672 and similar products can reduce the mounting area by approximately 40 percent compared to existing 3 mm × 3 mm packages. This can reduce the size and weight of end-use products.

I am pleased to announce that Epic will open an office in Brussels. We will implement closer collaboration with the EU in order to better represent the interests of our members and photonics, a key enabling technology and future EU Public-Private Partnership.” 

For its part, Fusion will back the SCSI Express approach because it is based on the work of a recognized standards group, the ANSI T10 committee. Access to the NVMe spec requires signing a legal document managed by Intel Corp., the group’s leader, said Gary Orenstein, vice president of products at Fusion IO.

Renesas achieved the use of 2 mm × 2 mm ultra compact packages by placing large-area high-performance chips in miniature packages and using an exposed heat sinkminiature package, thus efficiently dissipating the package heat to the mounting board. The µPA2600 and similar products can reduce the mounting area by approximately 30 percent compared to existing 3 mm × 2 mm packages, and the µPA2672 and similar products can reduce the mounting area by approximately 40 percent compared to existing 3 mm × 3 mm packages. This can reduce the size and weight of end-use products.

I am pleased to announce that Epic will open an office in Brussels. We will implement closer collaboration with the EU in order to better represent the interests of our members and photonics, a key enabling technology and future EU Public-Private Partnership.” 

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Renesas achieved the use of 2 mm × 2 mm ultra compact packages by placing large-area high-performance chips in miniature packages and using an exposed heat sinkminiature package, thus efficiently dissipating the package heat to the mounting board. The µPA2600 and similar products can reduce the mounting area by approximately 30 percent compared to existing 3 mm × 2 mm packages, and the µPA2672 and similar products can reduce the mounting area by approximately 40 percent compared to existing 3 mm × 3 mm packages. This can reduce the size and weight of end-use products.

I am pleased to announce that Epic will open an office in Brussels. We will implement closer collaboration with the EU in order to better represent the interests of our members and photonics, a key enabling technology and future EU Public-Private Partnership.” 

I am pleased to announce that Epic will open an office in Brussels. We will implement closer collaboration with the EU in order to better represent the interests of our members and photonics, a key enabling technology and future EU Public-Private Partnership.” 

According to a report by the Reuters news service, the Nikkei reported that Toshiba could seek financial assistance from the government-backed Enterprise Turnaround Initiative Corp of Japan.

User interfaces are rapidly transitioning from knobs and pushbuttons to touch sensing, which is more aesthetically pleasing, durable and easier to clean. Microchip has built a rich portfolio of touch-sensing solutions—many of which use our microcontrollers’ existing capabilities—to enable this transition.

BRUSSELS–Mobile phones have become such personal devices that some would rather share a toothbrush than a handset. But as our attachment to our cell phones increases, so too does consumer concern about data privacy and security.