Trenz Electronic

A streamlining program is taking place throughout the company to eliminate redundancies, Fiorina told the analysts. As an example, she noted that HP employees wanting online training today can access any of 1,000 Web sites. There is also an emphasis on reducing the number of platforms, she said, noting that an Internet appliance under development was recently scrapped.

AVX, which claims to have been one of the first passive-component makers to create a Web presence, is enhancing its site. Among the features available is an interactive modeling program for system designers.

Steve Hillenius, who heads the ULSI device technology research department at Bell Labs, said the progress achieved by Bell Labs and others might push out the need for alternatives to gate oxide materials.

SAN JOSE, Calif. — Emphasizing bandwidth over density, Cypress Semiconductor Corp. today will unveil a family of quad-port RAMs designed to allow data-intensive network traffic to flow more smoothly. The product family is the latest effort by Cypress to bring its traditional SRAM strengths to bear in fast-growing markets such as Internet-access equipment and storage-area networks.

pvc hook up wire

AVX, which claims to have been one of the first passive-component makers to create a Web presence, is enhancing its site. Among the features available is an interactive modeling program for system designers.

Steve Hillenius, who heads the ULSI device technology research department at Bell Labs, said the progress achieved by Bell Labs and others might push out the need for alternatives to gate oxide materials.

SAN JOSE, Calif. — Emphasizing bandwidth over density, Cypress Semiconductor Corp. today will unveil a family of quad-port RAMs designed to allow data-intensive network traffic to flow more smoothly. The product family is the latest effort by Cypress to bring its traditional SRAM strengths to bear in fast-growing markets such as Internet-access equipment and storage-area networks.

Moltech Corp.(520) 799-7500www.moltech.comEETInfo No. 604

The electronic-component industry is still in the process of defining a complete set of design guidelines for chip-scale packaging. Key issues surrounding the implementation of the packaging technology include the need for customers to tune their assembly and board-level design processes to be compatible with chip-scale.

Gina Roos is a freelance writer based in Plymouth, Mass.

GUC1R200_Datasheet PDF

Steve Hillenius, who heads the ULSI device technology research department at Bell Labs, said the progress achieved by Bell Labs and others might push out the need for alternatives to gate oxide materials.

SAN JOSE, Calif. — Emphasizing bandwidth over density, Cypress Semiconductor Corp. today will unveil a family of quad-port RAMs designed to allow data-intensive network traffic to flow more smoothly. The product family is the latest effort by Cypress to bring its traditional SRAM strengths to bear in fast-growing markets such as Internet-access equipment and storage-area networks.

Moltech Corp.(520) 799-7500www.moltech.comEETInfo No. 604

The electronic-component industry is still in the process of defining a complete set of design guidelines for chip-scale packaging. Key issues surrounding the implementation of the packaging technology include the need for customers to tune their assembly and board-level design processes to be compatible with chip-scale.

SAN JOSE, Calif. — Emphasizing bandwidth over density, Cypress Semiconductor Corp. today will unveil a family of quad-port RAMs designed to allow data-intensive network traffic to flow more smoothly. The product family is the latest effort by Cypress to bring its traditional SRAM strengths to bear in fast-growing markets such as Internet-access equipment and storage-area networks.

Moltech Corp.(520) 799-7500www.moltech.comEETInfo No. 604

The electronic-component industry is still in the process of defining a complete set of design guidelines for chip-scale packaging. Key issues surrounding the implementation of the packaging technology include the need for customers to tune their assembly and board-level design processes to be compatible with chip-scale.

micro processor unit

Moltech Corp.(520) 799-7500www.moltech.comEETInfo No. 604

The electronic-component industry is still in the process of defining a complete set of design guidelines for chip-scale packaging. Key issues surrounding the implementation of the packaging technology include the need for customers to tune their assembly and board-level design processes to be compatible with chip-scale.

The electronic-component industry is still in the process of defining a complete set of design guidelines for chip-scale packaging. Key issues surrounding the implementation of the packaging technology include the need for customers to tune their assembly and board-level design processes to be compatible with chip-scale.

Gina Roos is a freelance writer based in Plymouth, Mass.

This version of CorePCI, based on RTL (register transfer level) software code, is the first programmable 64-bit, 66-MHz PCI core to offer a complete solution, claimed Anil Reddy, senior manager of IP and design services marketing at Actel.

Usar Systems Inc., a developer of input-device and power-management ICs, recently announced implementation of its Smart Battery System Manager. The ACPITroller family implements an SBSM system for both single- and dual-battery subsystems, which can extend notebook-battery run time by 20% and enable up to a 60% faster charge of batteries in a dual battery system.