Bridgetek

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Laird - Signal Integrity ProductsBy Radio Bridge Inc.With Alpha Wire

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Analysts expect Jabil to expand internally by more than 50% next year, driven by more contracts with communication OEMs combined with expanded business relationships with current clients.

What I found interesting in particular is that based on the conservative attitudes of such end-user industries as pharmaceuticals, food and beverage, chemicals, and oil and gas towards implementing new technologies based on faith they will eventually benefit the user, is a major restraint in industrial networking penetration. That conservative stance really doesn’t hold up across the board given other industries. There’s a lot of resorting to workshops, and education regarding the advantages of integrating industrial networking into the manufacturing process—so in Europe, the move hasn’t happened here to any great extent.

"Germany, the US and Japan have been increasing their spend on science and are now reaping the benefits. Over the next three years, the UK science budget will grow by 7% in real terms, equivalent to almost £1bn."

The most important market for semiconductor products is smart mobility. For this market the SoC device needs to integrate many functions. In most cases the pure high-performance logic would be about 25% of the die area, 50% would be memories and the rest would be analog functions such as I/O. In 2D they all need to be processed together and bear the same manufacturing costs. In a monolithic 3D-IC stack using heterogeneous integration each stratum is processed in an optimized flow, allowing for a significant cost reduction. The following illustration suggests the use of only two strata to build a device that in 2D would have a size of 196 mm2 . By having one stratum for logic and one for memory, and by using DRAM instead of SRAM, the device could be reduced to 98 mm2 with footprint of 49 mm2 . The device cost would be further reduced by the memory using only 3 or 4 metal layers.

C-Ton Industries

CW0103K600JE73_Vishay Dale_Through Hole Resistors

Lumex, Inc.By FerriShieldWith Volex

What I found interesting in particular is that based on the conservative attitudes of such end-user industries as pharmaceuticals, food and beverage, chemicals, and oil and gas towards implementing new technologies based on faith they will eventually benefit the user, is a major restraint in industrial networking penetration. That conservative stance really doesn’t hold up across the board given other industries. There’s a lot of resorting to workshops, and education regarding the advantages of integrating industrial networking into the manufacturing process—so in Europe, the move hasn’t happened here to any great extent.

"Germany, the US and Japan have been increasing their spend on science and are now reaping the benefits. Over the next three years, the UK science budget will grow by 7% in real terms, equivalent to almost £1bn."

"Germany, the US and Japan have been increasing their spend on science and are now reaping the benefits. Over the next three years, the UK science budget will grow by 7% in real terms, equivalent to almost £1bn."

The most important market for semiconductor products is smart mobility. For this market the SoC device needs to integrate many functions. In most cases the pure high-performance logic would be about 25% of the die area, 50% would be memories and the rest would be analog functions such as I/O. In 2D they all need to be processed together and bear the same manufacturing costs. In a monolithic 3D-IC stack using heterogeneous integration each stratum is processed in an optimized flow, allowing for a significant cost reduction. The following illustration suggests the use of only two strata to build a device that in 2D would have a size of 196 mm2 . By having one stratum for logic and one for memory, and by using DRAM instead of SRAM, the device could be reduced to 98 mm2 with footprint of 49 mm2 . The device cost would be further reduced by the memory using only 3 or 4 metal layers.

If you found this article to be of interest, visit EDA Designline where you will find the latest and greatest design, technology, product, and news articles with regard to all aspects of Electronic Design Automation (EDA).

Tridium’s Niagara AX Framework Software controls millions of industrial control systems, heating, lighting, and security devices via the Internet. The U.S. Department of Homeland Security (DHS) issued a vulnerabilities warning that the company’s software, with 300,000 copies installed globally, contains a directory transversal flaw and weak credential storage. Attackers can potentially access and download files containing username and passwords for all who access a Niagara server within their company.

Micron

microcontroller unit

SeeedBy Pervasive DisplaysWith Inventus Power

The most important market for semiconductor products is smart mobility. For this market the SoC device needs to integrate many functions. In most cases the pure high-performance logic would be about 25% of the die area, 50% would be memories and the rest would be analog functions such as I/O. In 2D they all need to be processed together and bear the same manufacturing costs. In a monolithic 3D-IC stack using heterogeneous integration each stratum is processed in an optimized flow, allowing for a significant cost reduction. The following illustration suggests the use of only two strata to build a device that in 2D would have a size of 196 mm2 . By having one stratum for logic and one for memory, and by using DRAM instead of SRAM, the device could be reduced to 98 mm2 with footprint of 49 mm2 . The device cost would be further reduced by the memory using only 3 or 4 metal layers.

If you found this article to be of interest, visit EDA Designline where you will find the latest and greatest design, technology, product, and news articles with regard to all aspects of Electronic Design Automation (EDA).

Tridium’s Niagara AX Framework Software controls millions of industrial control systems, heating, lighting, and security devices via the Internet. The U.S. Department of Homeland Security (DHS) issued a vulnerabilities warning that the company’s software, with 300,000 copies installed globally, contains a directory transversal flaw and weak credential storage. Attackers can potentially access and download files containing username and passwords for all who access a Niagara server within their company.

Connect One

SR6438NWS-160_Datasheet PDF

ADLINK TechnologyBy YageoWith MMD Components

If you found this article to be of interest, visit EDA Designline where you will find the latest and greatest design, technology, product, and news articles with regard to all aspects of Electronic Design Automation (EDA).

Tridium’s Niagara AX Framework Software controls millions of industrial control systems, heating, lighting, and security devices via the Internet. The U.S. Department of Homeland Security (DHS) issued a vulnerabilities warning that the company’s software, with 300,000 copies installed globally, contains a directory transversal flaw and weak credential storage. Attackers can potentially access and download files containing username and passwords for all who access a Niagara server within their company.

The incorporation of FinFETs at 20-nm will enable UMC to offer a low-power version of its 20-nm process, in addition to a standard planar 20-nm process. Neither TSMC or Globalfoundries is planning to have a low-power 20-nm process. In April, Shang-yi Chiang, executive vice president and co-chief operating officer at TSMC, said critical dimensions are so tight at 20-nm that there isn’t enough room for tweaking design rules to specify different gate lengths to enable different flavors of 20-nm processes.

Qimonda

photoelectric sensor types

InoluxBy Inventek SystemsWith Oxley

Tridium’s Niagara AX Framework Software controls millions of industrial control systems, heating, lighting, and security devices via the Internet. The U.S. Department of Homeland Security (DHS) issued a vulnerabilities warning that the company’s software, with 300,000 copies installed globally, contains a directory transversal flaw and weak credential storage. Attackers can potentially access and download files containing username and passwords for all who access a Niagara server within their company.

The incorporation of FinFETs at 20-nm will enable UMC to offer a low-power version of its 20-nm process, in addition to a standard planar 20-nm process. Neither TSMC or Globalfoundries is planning to have a low-power 20-nm process. In April, Shang-yi Chiang, executive vice president and co-chief operating officer at TSMC, said critical dimensions are so tight at 20-nm that there isn’t enough room for tweaking design rules to specify different gate lengths to enable different flavors of 20-nm processes.

Jay Vleeschhouwer, an analyst at Merrill Lynch, has roughly the same Cadence and Mentor figures as Barr. He said it's possible that semiconductor weakness will impact EDA in 2001, but not likely. Would major semiconductor vendors react to short-term concerns like this in such a way as to impact their long-term competitiveness?” he asked. Customers have not suggested they're planning to do anything of the kind.”

Look for stepped-up activity in the automotive electronics arena, especially with regard to device motors and EMI/RFI protection to allow the vehicle systems to work as intended.

Glenair

PS7241E-1B-F3-A_Datasheet PDF

The incorporation of FinFETs at 20-nm will enable UMC to offer a low-power version of its 20-nm process, in addition to a standard planar 20-nm process. Neither TSMC or Globalfoundries is planning to have a low-power 20-nm process. In April, Shang-yi Chiang, executive vice president and co-chief operating officer at TSMC, said critical dimensions are so tight at 20-nm that there isn’t enough room for tweaking design rules to specify different gate lengths to enable different flavors of 20-nm processes.

Jay Vleeschhouwer, an analyst at Merrill Lynch, has roughly the same Cadence and Mentor figures as Barr. He said it's possible that semiconductor weakness will impact EDA in 2001, but not likely. Would major semiconductor vendors react to short-term concerns like this in such a way as to impact their long-term competitiveness?” he asked. Customers have not suggested they're planning to do anything of the kind.”

Look for stepped-up activity in the automotive electronics arena, especially with regard to device motors and EMI/RFI protection to allow the vehicle systems to work as intended.

difference between decoupling and bypass capacitor

MKS4O111502B00MSSD_Datasheet PDF

Cosel

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Altech Corporation

Vishay / Spectrol

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Advanced Photonix

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ASSMANN WSW Components

resistors colors

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