Trenz Electronic

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Knowles Johanson ManufacturingBy Fraenkische USA, LPWith Bel Power Solutions

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Two out of three aircraft encounters with turbulence occur in or around storms, where cloud movements can be used to detect the rough air, according to NCAR (which has a separate system for forecasting clear-air turbulence caused by the jet stream). Turbulence from winds flowing over mountains, or turbulence from local disturbances, such as the wake common during takeoffs, is the focus of separate efforts in the Aviation Weather Research Program and at the National Aeronautics and Space Administration.

About Xilinx Virtex-5 FPGAs Named 'Product and Innovation of the Year' by EDN Magazine, the Virtex-5 family represents the fifth generation in the award-winning Virtex series. Built upon the industry's most advanced 65nm triple-oxide technology, breakthrough new ExpressFabric(TM) technology and proven ASMBL(TM) architecture, the Virtex-5 family includes four domain-optimized platforms for high-speed logic, digital signal processing (DSP), embedded processing and serial connectivity applications. Devices are shipping now and may be purchased online or through Xilinx distributors. Visit www.xilinx.com/virtex5 for more information.

Although we do have a profitable BPON business, in our own self interest we would wish for a speedy transition. We recently crossed the threshold of our 50th design win for GPON. That is four times the number we have for BPON.”

Many outsourcing organizations are able to scale—e.g., add positions and sites as necessary—to accommodate workload requirements.

Future Technology Devices International, Ltd.

VS-VSKE250-12PBF_Datasheet PDF

Bosch SensortecBy Aries Electronics, Inc.With Phoenix Mecano

About Xilinx Virtex-5 FPGAs Named 'Product and Innovation of the Year' by EDN Magazine, the Virtex-5 family represents the fifth generation in the award-winning Virtex series. Built upon the industry's most advanced 65nm triple-oxide technology, breakthrough new ExpressFabric(TM) technology and proven ASMBL(TM) architecture, the Virtex-5 family includes four domain-optimized platforms for high-speed logic, digital signal processing (DSP), embedded processing and serial connectivity applications. Devices are shipping now and may be purchased online or through Xilinx distributors. Visit www.xilinx.com/virtex5 for more information.

Although we do have a profitable BPON business, in our own self interest we would wish for a speedy transition. We recently crossed the threshold of our 50th design win for GPON. That is four times the number we have for BPON.”

Although we do have a profitable BPON business, in our own self interest we would wish for a speedy transition. We recently crossed the threshold of our 50th design win for GPON. That is four times the number we have for BPON.”

Many outsourcing organizations are able to scale—e.g., add positions and sites as necessary—to accommodate workload requirements.

SAN JOSE, Calif. &#151 Chip-equipment maker Aviza Technology Inc. has entered into a joint development program with Taiwan's Mosel Vitelic Corp., under which the companies will co-develop advanced atomic layer deposition (ALD) materials for next-generation flash applications.

RPM Systems

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Taica CorporationBy BeckmanWith Cypress Semiconductor

Many outsourcing organizations are able to scale—e.g., add positions and sites as necessary—to accommodate workload requirements.

SAN JOSE, Calif. &#151 Chip-equipment maker Aviza Technology Inc. has entered into a joint development program with Taiwan's Mosel Vitelic Corp., under which the companies will co-develop advanced atomic layer deposition (ALD) materials for next-generation flash applications.

Finisar, the second largest OC company, posted the strongest quarter-on-quarter growth among the top 10 suppliers. Finisar gained 9 percent and posted revenues of $96 million for the quarter.

CBM America Corporation

RT0805FRE071K15L_Datasheet PDF

VirtiumBy Walsin TechnologyWith Cooper Bussmann

SAN JOSE, Calif. &#151 Chip-equipment maker Aviza Technology Inc. has entered into a joint development program with Taiwan's Mosel Vitelic Corp., under which the companies will co-develop advanced atomic layer deposition (ALD) materials for next-generation flash applications.

Finisar, the second largest OC company, posted the strongest quarter-on-quarter growth among the top 10 suppliers. Finisar gained 9 percent and posted revenues of $96 million for the quarter.

Since nanoparticles also interact with light, the technology also could be used in optoelectronic devices, using creating optical materials with new properties – if the printed structures are as small as the wavelength of the light, they could form lenses that band light inside future optical chips, the researchers raved.

OKI Semiconductor

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Kyocera DisplayBy Samsung SemiconductorWith Sensata Technologies – Deltatech

Finisar, the second largest OC company, posted the strongest quarter-on-quarter growth among the top 10 suppliers. Finisar gained 9 percent and posted revenues of $96 million for the quarter.

Finisar, the second largest OC company, posted the strongest quarter-on-quarter growth among the top 10 suppliers. Finisar gained 9 percent and posted revenues of $96 million for the quarter.

Since nanoparticles also interact with light, the technology also could be used in optoelectronic devices, using creating optical materials with new properties – if the printed structures are as small as the wavelength of the light, they could form lenses that band light inside future optical chips, the researchers raved.

The backplane connector line includes a press-fit, vertical card-edge connector that provides 170 contacts on a 0.75-mm pitch and enables AdvancedMC (AMC) cards to be plugged directly to a backplane, accommodating speeds up to 10 Gbits/s. A surface-mount version is also offered, which uses an optimized printed-circuit-board (PCB) footprint and supports differential signals at data rates up to 12.5 Gbits/s. Both versions are compatible with the PCB connector footprints defined in the MicroTCA specification.

VersaSense

1N5809US.TR_Datasheet PDF

Since nanoparticles also interact with light, the technology also could be used in optoelectronic devices, using creating optical materials with new properties – if the printed structures are as small as the wavelength of the light, they could form lenses that band light inside future optical chips, the researchers raved.

The backplane connector line includes a press-fit, vertical card-edge connector that provides 170 contacts on a 0.75-mm pitch and enables AdvancedMC (AMC) cards to be plugged directly to a backplane, accommodating speeds up to 10 Gbits/s. A surface-mount version is also offered, which uses an optimized printed-circuit-board (PCB) footprint and supports differential signals at data rates up to 12.5 Gbits/s. Both versions are compatible with the PCB connector footprints defined in the MicroTCA specification.

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VS-6CWT04FN_Datasheet PDF

Anaren

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Mill-Max

MikroElektronika

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Quest Manufacturing

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BI Technologies

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