Cymbet

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AUSTIN &#151 Obwohl die Meinungen über die genaue Definition des Begriffs weit auseinander klaffen, nimmt die Elektronikbranche jetzt die endgültige Eingemeindung der Nanotechnologie in Angriff. So bezeichnen sich die zwei größten Branchenorganisationen neuerdings als 'Nano-Player'.

In the past, EUV proponents claimed that current resists were suitable for production. However, Ware indicated that EUV will require more sensitive resists” in order for EUV tools to process wafers below 40-nm. It's one of the issues the industry must overcome,” Ware said.

Brown has set up a company, Nano Cluster Devices Ltd., to commercialize the process, which he said is compatible with current CMOS processes. Picking up on the potential of the approach, nanotechnology development firm NanoDynamics (Buffalo, N.Y.) signed a joint technology development agreement with Nano Cluster Devices in October.

The 1Mbit FRAM is available now. Built using Fujitsu's 0.35-micron CMOS process, the devices are housed in TSOP48 and FBGA48 packages. Sample pricing for the MB85R1001 and MB85R1001 begins at $19 each in 1,000-piece units.

ICE Components

2-2176238-4_TE Connectivity

Vision EngineeringBy Talon Communications, Inc.With Digi-Pas Technologies

In the past, EUV proponents claimed that current resists were suitable for production. However, Ware indicated that EUV will require more sensitive resists” in order for EUV tools to process wafers below 40-nm. It's one of the issues the industry must overcome,” Ware said.

Brown has set up a company, Nano Cluster Devices Ltd., to commercialize the process, which he said is compatible with current CMOS processes. Picking up on the potential of the approach, nanotechnology development firm NanoDynamics (Buffalo, N.Y.) signed a joint technology development agreement with Nano Cluster Devices in October.

Brown has set up a company, Nano Cluster Devices Ltd., to commercialize the process, which he said is compatible with current CMOS processes. Picking up on the potential of the approach, nanotechnology development firm NanoDynamics (Buffalo, N.Y.) signed a joint technology development agreement with Nano Cluster Devices in October.

The 1Mbit FRAM is available now. Built using Fujitsu's 0.35-micron CMOS process, the devices are housed in TSOP48 and FBGA48 packages. Sample pricing for the MB85R1001 and MB85R1001 begins at $19 each in 1,000-piece units.

Fujitsu's two 1Mbit FRAM devices ” the MB85R1001 (-8 bits) and the MB85R1002 (-16 bits) ” have the highest capacity of any FRAM product available today. The new devices have been built using the latest 0.35-micron 1T1C cell technology.

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Altech Corporation

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nVent SchroffBy ZMDIWith Comair Rotron

The 1Mbit FRAM is available now. Built using Fujitsu's 0.35-micron CMOS process, the devices are housed in TSOP48 and FBGA48 packages. Sample pricing for the MB85R1001 and MB85R1001 begins at $19 each in 1,000-piece units.

Fujitsu's two 1Mbit FRAM devices ” the MB85R1001 (-8 bits) and the MB85R1002 (-16 bits) ” have the highest capacity of any FRAM product available today. The new devices have been built using the latest 0.35-micron 1T1C cell technology.

Blade Servers Bust Out

The serpentine resistor is therefore constructed from a series of rectangular segments and, for accurate matching between resistors, the same geometry must be seen from the top and bottom. Both wet and dry etching processes cause an undercut effect that is less prominent when dummy resistors are created on each side of the main resistor segments.

Luminus Devices

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TEKTELIC CommunicationsBy Falconer Electronics, Inc.With Vishay / Semiconductor - Opto Division

Fujitsu's two 1Mbit FRAM devices ” the MB85R1001 (-8 bits) and the MB85R1002 (-16 bits) ” have the highest capacity of any FRAM product available today. The new devices have been built using the latest 0.35-micron 1T1C cell technology.

Blade Servers Bust Out

The serpentine resistor is therefore constructed from a series of rectangular segments and, for accurate matching between resistors, the same geometry must be seen from the top and bottom. Both wet and dry etching processes cause an undercut effect that is less prominent when dummy resistors are created on each side of the main resistor segments.

De alternativ som finns är HASL (Hot Air Solder Leveling), kemiskt tenn (Immersion Tin) Ni/Au (ENIG), kemiskt silver (Immersion Silver) och OSP. Kemiskt tenn och silver är relativt nya och tveksamma ur tillförlitlighetssynpunkt. HASL är inte lämplig för kapslar med liten bendelning, medan ENIG ger stora problem genom att vissa lödytor blir porösa och därmed får låg tillförlitlighet (black pad). Det gäller speciellt för kapslar med många anslutningar, typ BGA/CSP. Bäst är alltså OSP!

Macraigor Systems

zener diode characteristics circuit

MaxStream (Digi International)By Superior ElectricWith Newhaven Display, Intl.

Blade Servers Bust Out

The serpentine resistor is therefore constructed from a series of rectangular segments and, for accurate matching between resistors, the same geometry must be seen from the top and bottom. Both wet and dry etching processes cause an undercut effect that is less prominent when dummy resistors are created on each side of the main resistor segments.

The serpentine resistor is therefore constructed from a series of rectangular segments and, for accurate matching between resistors, the same geometry must be seen from the top and bottom. Both wet and dry etching processes cause an undercut effect that is less prominent when dummy resistors are created on each side of the main resistor segments.

De alternativ som finns är HASL (Hot Air Solder Leveling), kemiskt tenn (Immersion Tin) Ni/Au (ENIG), kemiskt silver (Immersion Silver) och OSP. Kemiskt tenn och silver är relativt nya och tveksamma ur tillförlitlighetssynpunkt. HASL är inte lämplig för kapslar med liten bendelning, medan ENIG ger stora problem genom att vissa lödytor blir porösa och därmed får låg tillförlitlighet (black pad). Det gäller speciellt för kapslar med många anslutningar, typ BGA/CSP. Bäst är alltså OSP!

Debashis Bhattacharya is CTO at Zenasis Technologies, a provider of transistor-level optimization tools.

MagnaChip built Tezzaron's RAM design on standard bulk” semiconductor wafers and supplied additional processing as needed. The companies intend to continue their association in creating additional 3D devices, said James Ayers, Jr., chairman and CEO of Tezzaron. In addition to the 3D RAM, our product roadmap includes many other commercial 3D devices that will be announced as FaStack ramps toward volume production,” he said.

Viega

CP002MR2490FP07_Vishay / Dale

De alternativ som finns är HASL (Hot Air Solder Leveling), kemiskt tenn (Immersion Tin) Ni/Au (ENIG), kemiskt silver (Immersion Silver) och OSP. Kemiskt tenn och silver är relativt nya och tveksamma ur tillförlitlighetssynpunkt. HASL är inte lämplig för kapslar med liten bendelning, medan ENIG ger stora problem genom att vissa lödytor blir porösa och därmed får låg tillförlitlighet (black pad). Det gäller speciellt för kapslar med många anslutningar, typ BGA/CSP. Bäst är alltså OSP!

Debashis Bhattacharya is CTO at Zenasis Technologies, a provider of transistor-level optimization tools.

MagnaChip built Tezzaron's RAM design on standard bulk” semiconductor wafers and supplied additional processing as needed. The companies intend to continue their association in creating additional 3D devices, said James Ayers, Jr., chairman and CEO of Tezzaron. In addition to the 3D RAM, our product roadmap includes many other commercial 3D devices that will be announced as FaStack ramps toward volume production,” he said.

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