Winbond Electronics Corporation

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MonnitBy EOS PowerWith BECOM Systems GmbH

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Our investment in Sequans shows our commitment to WiMAX and our interest in supporting the development of the leading WiMAX technologies,” said Karim El Naggar, vice president of Alcatel-Lucent WiMAX Business Unit in a statement Wednesday (Feb. 21) . Sequans' high-performance chips are an important element helping to ensure Alcatel-Lucent's leading position in this industry.”

San Jose, Calif.—To enable broadband point-to-point radios to carry voice and data traffic at multi-gigabit per second rates, Endwave Corp. has released a transmit-receive module that operates over the E-Band frequency spectrum from 71.0-86.0 GHz.

Still, MasterCard? This is same company that–collaborating with banks–mails millions of unsolicited cards annually in hopes of hooking people on revolving credit. Until now, credit card companies had little access to the world's poorest people because most of them lack mailboxes and many cannot read. But now, aided by mobile-phone operators and a new cash-transfer system, the door to the last credit-free people left on Earth swings open.

Gegenüber dem Januar 2006 lagen die Chip-Umsätze heuer nach Zahlen des ZVEI um 7 Prozent niedriger. Auch gegenüber dem Dezember 2006 schnitt der Januar 2007 leicht schwächer ab, was die Fachleute des ZVEI mit saisonalen Einflüssen erklären.

Adesto Technologies

MMT-110-02-S-SH-A-P_Datasheet PDF

Hittite (Analog Devices)By Murata Power SolutionsWith Semelab

San Jose, Calif.—To enable broadband point-to-point radios to carry voice and data traffic at multi-gigabit per second rates, Endwave Corp. has released a transmit-receive module that operates over the E-Band frequency spectrum from 71.0-86.0 GHz.

Still, MasterCard? This is same company that–collaborating with banks–mails millions of unsolicited cards annually in hopes of hooking people on revolving credit. Until now, credit card companies had little access to the world's poorest people because most of them lack mailboxes and many cannot read. But now, aided by mobile-phone operators and a new cash-transfer system, the door to the last credit-free people left on Earth swings open.

Still, MasterCard? This is same company that–collaborating with banks–mails millions of unsolicited cards annually in hopes of hooking people on revolving credit. Until now, credit card companies had little access to the world's poorest people because most of them lack mailboxes and many cannot read. But now, aided by mobile-phone operators and a new cash-transfer system, the door to the last credit-free people left on Earth swings open.

Gegenüber dem Januar 2006 lagen die Chip-Umsätze heuer nach Zahlen des ZVEI um 7 Prozent niedriger. Auch gegenüber dem Dezember 2006 schnitt der Januar 2007 leicht schwächer ab, was die Fachleute des ZVEI mit saisonalen Einflüssen erklären.

Memory will be among the first devices to deploy through-silicon vias, Stork said. But traditional wire-bonding and current chip-stacking techniques continue to make strides and may nudge out the need for true 3-D packaging. A factor in current packaging technology's favor, he said, is that it is remarkably cheap.”

Two operations become possible: The reuse of computational resources across modules in the design and the generation of an application-specific memory subsystem for faster data access,” the researchers said in a paper presented here at the VLSI Design meeting.

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Seoul SemiconductorBy Kilo InternationalWith WJ Communications

Gegenüber dem Januar 2006 lagen die Chip-Umsätze heuer nach Zahlen des ZVEI um 7 Prozent niedriger. Auch gegenüber dem Dezember 2006 schnitt der Januar 2007 leicht schwächer ab, was die Fachleute des ZVEI mit saisonalen Einflüssen erklären.

Memory will be among the first devices to deploy through-silicon vias, Stork said. But traditional wire-bonding and current chip-stacking techniques continue to make strides and may nudge out the need for true 3-D packaging. A factor in current packaging technology's favor, he said, is that it is remarkably cheap.”

Two operations become possible: The reuse of computational resources across modules in the design and the generation of an application-specific memory subsystem for faster data access,” the researchers said in a paper presented here at the VLSI Design meeting.

Availability: NowPricing: $1.34 each in 10,000-piece quantitiesData Sheet: click here

Circuit Scribe/Electroninks Writeables Inc.

C315C821J1G5TA7303_Datasheet PDF

ToyocomBy E-Z-HookWith Infineon Technologies

Memory will be among the first devices to deploy through-silicon vias, Stork said. But traditional wire-bonding and current chip-stacking techniques continue to make strides and may nudge out the need for true 3-D packaging. A factor in current packaging technology's favor, he said, is that it is remarkably cheap.”

Two operations become possible: The reuse of computational resources across modules in the design and the generation of an application-specific memory subsystem for faster data access,” the researchers said in a paper presented here at the VLSI Design meeting.

Availability: NowPricing: $1.34 each in 10,000-piece quantitiesData Sheet: click here

The LM5116 is available in a power-enhanced TSSOP-20 package featuring an exposed die attach pad to aid in thermal dissipation.

Maple Systems

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Mechatronics Bearing GroupBy Allied ComponentsWith Circuit Scribe/Electroninks Writeables Inc.

Two operations become possible: The reuse of computational resources across modules in the design and the generation of an application-specific memory subsystem for faster data access,” the researchers said in a paper presented here at the VLSI Design meeting.

Availability: NowPricing: $1.34 each in 10,000-piece quantitiesData Sheet: click here

Availability: NowPricing: $1.34 each in 10,000-piece quantitiesData Sheet: click here

The LM5116 is available in a power-enhanced TSSOP-20 package featuring an exposed die attach pad to aid in thermal dissipation.

The NCP5662 is a 2 A linear regulator with enable. It is available with 1.5 V, 3.3 V and adjustable output voltages. Offered in a Pb-free D2PAK package, it is priced at $0.57 per unit in 800-unit quantities. This device family will also be available in a 4 mm x 4 mm DFN package later this year.

RIGOL Technologies

FTE-111-03-G-DH_Datasheet PDF

The LM5116 is available in a power-enhanced TSSOP-20 package featuring an exposed die attach pad to aid in thermal dissipation.

The NCP5662 is a 2 A linear regulator with enable. It is available with 1.5 V, 3.3 V and adjustable output voltages. Offered in a Pb-free D2PAK package, it is priced at $0.57 per unit in 800-unit quantities. This device family will also be available in a 4 mm x 4 mm DFN package later this year.

piezo electric devices

RNR70E2004DMBSL4_Datasheet PDF

TE Connectivity AMP Connectors

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Taiwan Semiconductor

MMD Components

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TriQuint

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Integrated Silicon Solution, Inc. (ISSI)

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