Pepperl+Fuchs

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MakeblockBy Allegro MicroSystemsWith BDNC (Holding) Limited

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Mer-Mar Inc. 7042 Santa Fe Ave. E.Building A1Hesperia, Calif. 92345(760) 244-6149President: John K. MerellKey sales executive: L.C. MenkesYear founded: 19741999 revenue: $4.6 millionEmployees: 48Manufacturing facilities: 1Overseas facilities: 0Surface-mount lines: 3Square footage of largest facility: 22,000Active customers: 12Turnkey: 98%Consignment: 2%Acquisitions since January 1999: 0

To get the best results from layout characterization and optimization software, you need to take into account process characteristics,” said Thomas Waas, co-founder of AISS. Now, we can provide customers with the most physically accurate solution by complementing our own layout expertise with PDF's process characterization and optimization solutions.”

We hope the market's acceptance of the 820E will be good,” said Jason Chen, a vice president of Intel's Asia-Pacific regional division. The chipset is ready for shipment from about 30 Taiwanese makers of motherboards and systems,” including Acer Open Inc., First International Computer Inc., Microstar International Inc., and Asustek Computer Inc.

JAE Electronics

MMC16.5475M63C31BULK

Cardinal ComponentsBy Quest ManufacturingWith Taiwan Semiconductor

To get the best results from layout characterization and optimization software, you need to take into account process characteristics,” said Thomas Waas, co-founder of AISS. Now, we can provide customers with the most physically accurate solution by complementing our own layout expertise with PDF's process characterization and optimization solutions.”

We hope the market's acceptance of the 820E will be good,” said Jason Chen, a vice president of Intel's Asia-Pacific regional division. The chipset is ready for shipment from about 30 Taiwanese makers of motherboards and systems,” including Acer Open Inc., First International Computer Inc., Microstar International Inc., and Asustek Computer Inc.

The 64-pin FBGA package has dimensions of 8-mm by 1.2 mm by 1.2 mm and lead spacings of 0.80-mm pitch.

ESD is a separate issue. ESD devices must have fast response and are increasingly required to provide protection well above the 2-kV spec that is served well in many applications.

Seeed

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General ElectricBy Inspired LEDWith LMB Heeger, Inc.

We hope the market's acceptance of the 820E will be good,” said Jason Chen, a vice president of Intel's Asia-Pacific regional division. The chipset is ready for shipment from about 30 Taiwanese makers of motherboards and systems,” including Acer Open Inc., First International Computer Inc., Microstar International Inc., and Asustek Computer Inc.

The 64-pin FBGA package has dimensions of 8-mm by 1.2 mm by 1.2 mm and lead spacings of 0.80-mm pitch.

ESD is a separate issue. ESD devices must have fast response and are increasingly required to provide protection well above the 2-kV spec that is served well in many applications.

We already have significant success. There are only three manufacturers that have selected a DSP for commercial deployment of wireless-infrastructure equipment for 3G wireless or wideband CDMA, and all three have selected our DSP.”

AIM Electronics

REA222M0JBK-1016S

SemitecBy Signal TransformersWith Asahi Kasei

The 64-pin FBGA package has dimensions of 8-mm by 1.2 mm by 1.2 mm and lead spacings of 0.80-mm pitch.

ESD is a separate issue. ESD devices must have fast response and are increasingly required to provide protection well above the 2-kV spec that is served well in many applications.

We already have significant success. There are only three manufacturers that have selected a DSP for commercial deployment of wireless-infrastructure equipment for 3G wireless or wideband CDMA, and all three have selected our DSP.”

CALL (800) 262-5643www.analog.comEETInfo No. 644

Tekmos

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United MonolithicBy Citizen Finedevice Co., LTD.With Winbond Electronics Corporation

ESD is a separate issue. ESD devices must have fast response and are increasingly required to provide protection well above the 2-kV spec that is served well in many applications.

We already have significant success. There are only three manufacturers that have selected a DSP for commercial deployment of wireless-infrastructure equipment for 3G wireless or wideband CDMA, and all three have selected our DSP.”

We already have significant success. There are only three manufacturers that have selected a DSP for commercial deployment of wireless-infrastructure equipment for 3G wireless or wideband CDMA, and all three have selected our DSP.”

CALL (800) 262-5643www.analog.comEETInfo No. 644

Tracking multiple Lean Manufacturing and Six Sigma KPIs helps to identify areas for business performance and efficiency improvement. Enhanced product quality reports and root-cause analysis capabilities drive manufacturing process improvement over time. A single view of customer information, order status and product location enables customer services to respond instantly to customer inquiries. Real-time visibility into the entire supply chain supports capable-to-promise” and available-to-promise” capabilities. To survive in future it will be necessary for manufacturer to connect all parts and divisions of their global located enterprises with the appropriate software to get the required information immediately to do their business successfully.

Micro Dynamics Corp.* 7550 Market Place Dr.Eden Prairie, Minn. 55344(612) 941-8071www.microdynamics.comPresident: Mike BrownKey sales executive: Win WoodYear founded: 19811998 revenue: $15 millionEmployees: 200Manufacturing facilities: 2Overseas facilities: n/aSurface-mount lines: 6Square footage of largest facility: 40,000Active customers: 30+Turnkey: 80%Consignment: 20%

Epcos

M8340107M1001GGDSL

CALL (800) 262-5643www.analog.comEETInfo No. 644

Tracking multiple Lean Manufacturing and Six Sigma KPIs helps to identify areas for business performance and efficiency improvement. Enhanced product quality reports and root-cause analysis capabilities drive manufacturing process improvement over time. A single view of customer information, order status and product location enables customer services to respond instantly to customer inquiries. Real-time visibility into the entire supply chain supports capable-to-promise” and available-to-promise” capabilities. To survive in future it will be necessary for manufacturer to connect all parts and divisions of their global located enterprises with the appropriate software to get the required information immediately to do their business successfully.

Micro Dynamics Corp.* 7550 Market Place Dr.Eden Prairie, Minn. 55344(612) 941-8071www.microdynamics.comPresident: Mike BrownKey sales executive: Win WoodYear founded: 19811998 revenue: $15 millionEmployees: 200Manufacturing facilities: 2Overseas facilities: n/aSurface-mount lines: 6Square footage of largest facility: 40,000Active customers: 30+Turnkey: 80%Consignment: 20%

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Tekmos

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Brady Corporation

Nordic Semiconductor

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Burr Brown

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Hologram

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